Ultrafast Picosecond Infrared Green UV Laser Cutting Machine OLED Screen Photovoltaic Glass Scribing Magnetic Material FPC Film Cutting Perforation Ultrafast picosecond Laser Cutting Machines are usually divided into infrared, green light and ultraviolet according to wavelength. The latter two are usually derived from infrared picosecond frequency doubling. This type of Mixed Laser Cutting Machine is characterized by a pulse width of picoseconds, and can usually use burst mode to further concentrate energy and reduce thermal effects. At present, the most commonly used functions of this type of ultrafast cutting machine are cutting, punching, and scribing precision glass, such as OLED, Mini LED, Micro LED and photovoltaic glass panel Scribe Machine, as well as cutting of complex shapes of wafers such as MEMS. With the large-scale mass production and technological iteration of new energy vehicles, energy storage, and new generation displays, the demand for such laser equipment has in…
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